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SoIC Demand Heats Up as Apple, NVIDIA, AMD Drive

Driven by the AI wave, advanced packaging accelerates production expan...

AMD Announces Discontinuation of Various FPGAs

AMD has issued a product discontinuation notice for a number of progra...

Littelfuse's New Ultra-Miniature 12.7mm Reed Switches

Littelfuse announced the launch of the MATE-12B reed switch series whi...

Infineon has introduced a magnetic sensor for micron-level m...

Infineon has introduced a magnetic sensor for micron-level motion meas...

Molex Launches KickStart Connector System, First to Meet OCP...

Molex launches KickStart Connector System, an OCP-compliant, all-in-on...

77GHz Automotive radar IC for Vehicles with Satellite Archit...

AWR2544, is fabricated using 45 nm RFCMOS and is targeted for use in "...

Chiplet is regarded as the era of large computing power "lif...

Recently, 12 Japanese automakers, parts manufacturers and five semicon...

FET3588-C board temperature width upgraded, fearless of heat...

Based on the RK3588 series processor, Feiling Embedded has launched tw...

TSMC Japan plant, will introduce 12nm

Japanese media reported that TSMC in Japan Kumamoto Prefecture, a new ...

U.S. Department of Commerce to investigate "key industries t...

The U.S. Department of Commerce said on December 21 that it would laun...