SoIC Demand Heats Up as Apple, NVIDIA, AMD Drive

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Recent media reports indicate that TSMC has revised its SoIC (System-on-Chip) production capacity plan, and the monthly production capacity at the end of this year will jump from about 2,000 chips at the end of 2023 to 5,000~6,000 chips, in order to meet the strong demand for AI and HPC in the future.

Data shows that TSMC SoIC is the industry's first high-density 3D small chip stacking technology, through the Chip on Wafer (CoW) packaging technology, can be heterogeneous integration of different sizes, functions, nodes of the die, and Zhunan six plants (AP6) into mass production.

TSMC is actively developing 3D stacked SoIC, the industry is expected to debut major customer AMD MI300 will use SoIC with CoWoS. At the same time, TSMC's largest customer Apple's interest in SoIC is also quite strong, it is reported that it will take the SoIC with Hybrid (Thermoplastic Carbon Fibre Plate Composite Moulding Technology), is currently in a small amount of trial production, is expected to be in mass production in 2025 ~ 2026, to be applied to Mac, iPad, and other mobile devices. To be applied in Mac, iPad and other products, and manufacturing costs more advantageous than the current programme.

NVIDIA although the current high-end products mainly use CoWoS packaging technology, but the industry believes that the future will also be further imported into SoIC technology. In AMD, Apple, NVIDIA three major manufacturers urged, TSMC SoIC production expansion can not be delayed.